← October 14, 2026 briefing · added in the 16:00 KST update
SK hynix aims to finalize standard for next-gen AI memory 'HBF' in January, with Sandisk, Google in consortium (report)
Announced October 14, 2026
Verified (fact)
According to ZDNet Korea, SK hynix President Ahn Hyun said in a keynote at SEDEX 2026 on Oct. 14 that the company plans to establish the final-stage standard for High Bandwidth Flash (HBF) in January next year. The first standard was released in July last year. HBF is a new memory tier between HBM and SSDs that stacks NAND vertically and connects it with TSVs. Ahn said the company has formed a consortium with Sandisk and cloud service providers such as Google. The company also plans to expand its lineup beyond HBM into 3D-stacked DRAM, CXL and high-speed I/O SSDs.
Why it matters (interpretation)
As reasoning models' context and KV caches grow, a memory tier with more capacity than HBM has become necessary. Once the standard is finalized, AI server memory configurations could change.
Confidence medium · official source pending
Sources
- Press SK하이닉스, 내년 1월 HBF 최종 표준 제정 목표…차세대 AI 메모리 선점 시동 ZDNet Korea
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